Patents

Kathryn holds over 65 patents, reflecting her extensive contributions to semiconductor technology and integrated circuits. Her innovations include advancements in double-gate transistor structures, three-dimensional integrated circuits, and nonvolatile memory devices utilizing semiconductor nanocrystals. These patents highlight her role in pioneering developments that have significantly influenced modern electronics.

Patent list

Nonvolatile Memory Device Using Semiconductor Nanocrystals And Method Of Forming Same

Patent No.: US 8,987,138 B2.

Interconnect Structures With Engineered Dielectrics With Nanocolumnar Porosity

Patent No.: US 8,901,741 B2.

Method Of Forming A Nonvolatile Memory Device Using Semiconductor Nanoparticles

Patent No.: US 7,985,686 B2.

Self-Aligned Planar Double-Gate Transistor Structure

Patent No.: US 7,960,790 B2.

Three Dimensional Integrated Circuit And Method Of Design

Patent No.: US 7,723,207 B2.

Low Temperature Fusion Bonding With High Surface Energy Using A Wet Chemical Treatment

Patent No.: US 7,566,631 B2.

High-Performance CMOS Devices On Hybrid Crystal Oriented Substrates

Patent No.: US 7,329,923 B2.

Connection Device With Actuating Element For Changing A Conductive State Of A Via

Patent No.: US 7,342,301 B2.

Integration Of Strained Ge Into Advanced CMOS Technology

Patent No.: US 7,244,958.

Self-Aligned Planar Double-Gate Process By Self-Aligned Oxidation

Patent No.: US 7,205,185 B2.

Nonvolatile Memory Device Using Semiconductor Nanocrystals And Method Of Forming Same

Patent No.: US 7,045,851 B2.

Method Of Fabricating Silicon Devices On Sapphire With Wafer Bonding At Low Temperature

Patent No.: US 6,911,375 B2.

Three Dimensional Integrated Circuit

Patent No.: US 7,312,476 B2.

Three Dimensional CMOS Integrated Circuits Having Device Layers Built On Different Crystal Oriented Wafers

Patent No.: US 6,821,826 B1.

Self-Aligned SOI With Different Crystal Orientation Using Wafer Bonding And SIMOX Processes

Patent No.: US 6,830,962 B1.

Semiconductor With Nanoscale Features

Patent No.: US 6,506,660 B2.

Self-Aligned Silicide Process Utilizing Ion Implants For Reduced Silicon Consumption And Control Of The Silicide Formation Temperature And Structure Formed Thereby

Patent No.: US 6,555,880 B2.

Self-Aligned Silicide Process For Silicon Sidewall Source And Drain Contacts

Patent No.: US 6,645,861 B2.

Self-Aligned Silicide Process For Reduction Of Si Consumption In Shallow Junction And Thin SOI Electronic Devices

Patent No.: US 6,444,578 B1.

Method For Increasing The Capacitance Of A Semiconductor Capacitor

Patent No.: US 6,358,813 B1.